- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/607 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of mechanical vibrations, e.g. ultrasonic vibrations
Patent holdings for IPC class H01L 21/607
Total number of patents in this class: 121
10-year publication summary
|
6
|
2
|
3
|
8
|
4
|
5
|
5
|
6
|
5
|
1
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Shinkawa Ltd. | 400 |
14 |
| Mitsubishi Electric Corporation | 43934 |
10 |
| Panasonic Corporation | 20786 |
6 |
| Kulicke and Soffa Industries, Inc. | 292 |
5 |
| Orthodyne Electronics Corporation | 19 |
4 |
| Fujitsu Limited | 19265 |
3 |
| Rohm Co., Ltd. | 5843 |
3 |
| Toshiba Mitsubishi-Electric Industrial Systems Corporation | 1583 |
3 |
| Infineon Technologies AG | 8189 |
2 |
| Murata Manufacturing Co., Ltd. | 22355 |
2 |
| Nissan Motor Co., Ltd. | 12249 |
2 |
| Kyocera Corporation | 12735 |
2 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
2 |
| Fuji Electric Co., Ltd. | 4750 |
2 |
| Alps Electric Co., Ltd. | 851 |
2 |
| Automotive Energy Supply Corporation | 67 |
2 |
| Hesse GmbH | 52 |
2 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6132 |
2 |
| Sharp Kabushiki Kaisha | 18957 |
2 |
| Hesse & Knipps GmbH | 8 |
2 |
| Other owners | 49 |